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NTMFS4833N
Power MOSFET
30 V, 191 A, Single N ? Channel, SO ? 8FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These are Pb ? Free Devices
http://onsemi.com
Applications
? Refer to Application Note AND8195/D
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
V (BR)DSS
30 V
R DS(ON) MAX
2.0 m W @ 10 V
3.0 m W @ 4.5 V
D (5)
I D MAX
191 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
± 20
V
V
G (4)
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
28
20.5
2.7
A
W
S (1,2,3)
N ? CHANNEL MOSFET
MARKING
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
ID
P D
I D
16
12
1.1
191
138
A
W
A
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
S
S
S
G
DIAGRAM
D
4833N
AYWZZ
D
D
D
Power Dissipation
R q JC (Note 1)
Pulsed Drain
Current
T C = 25 ° C
T A = 25 ° C,
t p = 10 m s
P D
I DM
113.6
288
W
A
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
T J , T STG
I S
dV/dt
? 55 to
+150
104
6
° C
A
V/ns
ORDERING INFORMATION
Device Package Shipping ?
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 35 A pk , L = 1.0 mH, R G = 25 W)
EAS
612.5
mJ
NTMFS4833NT1G
NTMFS4833NT3G
SO ? 8FL
(Pb ? Free)
SO ? 8FL
1500/Tape & Reel
5000/Tape & Reel
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
(Cu area = 50 mm 2 [1 oz])
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2014
March, 2014 ? Rev. 10
1
Publication Order Number:
NTMFS4833N/D
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